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The gpu is now built like a city

14:07 ISTby Yethikrishna R

the gpu is now built like a city: tsmc’s cowos-l stays the main packaging line for ai chips through 2028 as nvidia shipments grow 30 percent this year, and the advanced packaging market passes 52 billion dollars in 2026, over half of all packaging. packages now span 240 millimeters with hbm stacked on top. the transistor is becoming the least interesting part.

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